Vertical interconnect modeling between GCPWs in LTCC technology

Abstract

In this paper, vertical via interconnects between Grounded Coplanar Waveguide (GCPW) transmission lines in Low Temperature Cofired Ceramic (LTCC) Technology has been simulated for realization at C-MET, Pune. The S-parameters of the overall structure have been computed. A parametric study has been performed by varying via parameters like via diameter, via height and the resulting performance has been analyzed. An equivalent lumped element model for vias has been shown and the corresponding model parameters are extracted. The insertion loss is observed to be better than 0.4 dB and return loss is below -14 dB up to 10 GHz frequency. © 2012 IEEE.