Effect of substrate on electroplated copper sulphide thin films

dc.contributor.author	Bharathi, B.
dc.contributor.author	Thanikaikarasan, S.
dc.contributor.author	Kollu, Pratap
dc.contributor.author	Chandrasekar, P. V.
dc.contributor.author	Sankaranarayanan, K.
dc.contributor.author	Shajan, X. Sahaya
dc.date.accessioned	2022-03-27T06:45:13Z
dc.date.available	2022-03-27T06:45:13Z
dc.date.issued	2014-11-06
dc.description.abstract	Copper Sulphide thin films have been prepared on different substrates using electrodeposition technique. X-ray diffraction analysis showed that the prepared films possess polycrystalline in nature with cubic structure. Microstructural parameters such as crystallite size, strain and dislocation density are determined using X-ray diffraction data. Film composition and surface morphology have been analyzed using Scanning electron microscopy and Energy dispersive analysis by X-rays. Optical absorption analysis showed that the prepared films possess band gap value in the range between 2.2 and 2.4 eV for films obtained on different substrates.
dc.identifier.citation	Journal of Materials Science: Materials in Electronics. v.25(12)
dc.identifier.issn	09574522
dc.identifier.uri	10.1007/s10854-014-2310-7
dc.identifier.uri	http://link.springer.com/10.1007/s10854-014-2310-7
dc.identifier.uri	https://dspace.uohyd.ac.in/handle/1/10061
dc.title	Effect of substrate on electroplated copper sulphide thin films
dc.type	Journal. Article
dspace.entity.type

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