Deposition of stress-free diamond films on Si by diamond/β-SiC nanocomposite intermediate layers

dc.contributor.author Srikanth, Vadali V.S.S.
dc.contributor.author Staedler, Thorsten
dc.contributor.author Jiang, Xin
dc.date.accessioned 2022-03-27T04:03:51Z
dc.date.available 2022-03-27T04:03:51Z
dc.date.issued 2009-10-01
dc.description.abstract Stress-free diamond films have been synthesized by using microwave plasma enhanced chemical vapour deposition (MWCVD) technique. Nanocrystalline diamond/β-SiC gradient composite film system was used as an interlayer for the diamond top layers. As a result, Raman phonon line shifts (obtained from diamond top layers) corresponding to diamond are recorded very close to the stress-free value of 1332 cm- 1. This implies an extraordinarily low biaxial compressive stress state in the diamond films. The interlayer accommodates to a considerable extent, the stress that occurs due to the difference in the thermal expansion coefficient of the diamond film and the underlying substrate. © 2009 Elsevier B.V. All rights reserved.
dc.identifier.citation Diamond and Related Materials. v.18(10)
dc.identifier.issn 09259635
dc.identifier.uri 10.1016/j.diamond.2009.07.007
dc.identifier.uri https://www.sciencedirect.com/science/article/abs/pii/S092596350900212X
dc.identifier.uri https://dspace.uohyd.ac.in/handle/1/6121
dc.subject CVD diamond
dc.subject Interlayer
dc.subject Nanocomposite
dc.subject Stress
dc.title Deposition of stress-free diamond films on Si by diamond/β-SiC nanocomposite intermediate layers
dc.type Journal. Article
dspace.entity.type
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