Surface roughness characterization of annealed polycrystalline silicon solar wafers using a laser speckle imaging (LSI) technique

dc.contributor.author Balamurugan, R.
dc.contributor.author Prakasam, R.
dc.date.accessioned 2022-03-27T08:38:53Z
dc.date.available 2022-03-27T08:38:53Z
dc.date.issued 2020-01-01
dc.description.abstract Surface roughness variation of optically rough polycrystalline silicon solar wafer by annealing at different temperatures is presented. Laser speckle images produced by annealed polycrystalline silicon solar wafer wafers are recorded and converted into binary images. The binary speckle images are characterized by fractal box counting method. The fractal dimensions decreases, while annealing temperature increases; therefore, the polycrystalline silicon solar wafer roughness decreases while annealing temperature increases.
dc.identifier.citation Lasers in Engineering. v.47(4-6)
dc.identifier.issn 08981507
dc.identifier.uri https://dspace.uohyd.ac.in/handle/1/11353
dc.subject Annealing
dc.subject Diode laser
dc.subject Fractal dimension
dc.subject Laser speckle images
dc.subject Muffle furnace
dc.subject Polycrystalline silicon solar wafer
dc.subject Surface roughness
dc.title Surface roughness characterization of annealed polycrystalline silicon solar wafers using a laser speckle imaging (LSI) technique
dc.type Journal. Article
dspace.entity.type
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